Skip to main content
Federal & State Lawfederalstatelaw.com
Home/Federal/Bills (Live)
SENATE 2228118th CongressBecame Public Law No: 118-105.

Building Chips in America Act of 2023

Last Action
10/2/2024

Actions

  • 2024-10-02Became Public Law No: 118-105.
  • 2024-10-02Became Public Law No: 118-105.
  • 2024-10-02Signed by President.
  • 2024-10-02Signed by President.
  • 2024-09-24Presented to President.
  • 2024-09-24Presented to President.
  • 2024-09-23Motion to reconsider laid on the table Agreed to without objection.
  • 2024-09-23On motion to suspend the rules and pass the bill Agreed to by the Yeas and Nays: (2/3 required): 257 - 125 (Roll no. 440). (text: CR H5603-5604)
  • 2024-09-23Passed/agreed to in House: On motion to suspend the rules and pass the bill Agreed to by the Yeas and Nays: (2/3 required): 257 - 125 (Roll no. 440). (text: CR H5603-5604)
  • 2024-09-23Considered as unfinished business. (consideration: CR H5625-5626)
  • 2024-09-23At the conclusion of debate, the Yeas and Nays were demanded and ordered. Pursuant to the provisions of clause 8, rule XX, the Chair announced that further proceedings on the motion would be postponed.
  • 2024-09-23DEBATE - The House proceeded with forty minutes of debate on S. 2228.
  • 2024-09-23Considered under suspension of the rules. (consideration: CR H5603-5606)
  • 2024-09-23Mr. Lucas moved to suspend the rules and pass the bill.
  • 2023-12-19Held at the desk.

Showing 15 of 20 actions. Full history on Congress.gov.

CRS Summary

As of 2024-10-02 (49)

Building Chips in America Act of 2023

This bill modifies and limits the review of certain semiconductor (i.e., microchip) projects under the National Environmental Policy Act of 1969 (NEPA) and the National Historic Preservation Act (NHPA).

First, the bill exempts from NEPA and NHPA specified semiconductor projects that receive financial assistance under the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021, including semiconductor projects with (1) activities that commence by December 31, 2024; (2) federal financial assistance provided in the form of a loan or loan guarantee; or (3) federal financial assistance, excluding any loan or loan guarantee, that comprises no more than 10% of the total estimated cost of the project. Further, the bill exempts certain activities from NEPA relating to the construction, expansion, or modernization of semiconductor facilities by establishing several categorical exclusions.

Next, the bill allows the Department of Commerce to serve as the lead agency for the review of a semiconductor project that receives such financial assistance but is not exempted from review under NEPA.

In completing an environmental review under NEPA for semiconductor projects that receive such financial assistance, Commerce may rely on or adopt prior studies and decisions under certain circumstances.

Cosponsors (5)

  • Todd Young (R-IN)
  • Bill Hagerty (R-TN)
  • Sherrod Brown (D-OH)
  • Kyrsten Sinema (I-AZ)
  • Ted Budd (R-NC)

Subjects

  • Computers and information technology
  • Environmental assessment, monitoring, research
  • Government lending and loan guarantees
  • Industrial facilities
  • Industrial policy and productivity

Became law: Pub. L. 118-105

Read on Congress.gov

Sourced from Congress.gov (public domain).

This is legal information, not legal advice. Laws vary by jurisdiction and change frequently. Always verify current law with official sources and consult a licensed attorney in your jurisdiction for advice on your specific situation.