Notice2026-19777
Foreign-Trade Zone (FTZ) 106, Notification of Proposed Production Activity; Hitachi Vantara Manufacturing; (Enterprise Datacenter Disk Storage System Hardware); Norman, Oklahoma
Primary source
Metadata and text below are from the Federal Register, a public-domain U.S. government work. Always verify the official published version before relying on it for any legal matter.
Published
September 28, 2026
Issuing agencies
Commerce DepartmentForeign-Trade Zones Board
Full Text
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<title>Federal Register, Volume 91 Issue 186 (Monday, September 28, 2026)</title>
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[Federal Register Volume 91, Number 186 (Monday, September 28, 2026)]
[Notices]
[Page 61202]
From the Federal Register Online via the Government Publishing Office [<a href="http://www.gpo.gov">www.gpo.gov</a>]
[FR Doc No: 2026-19777]
[[Page 61202]]
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DEPARTMENT OF COMMERCE
Foreign-Trade Zones Board
[B-124-2026]
Foreign-Trade Zone (FTZ) 106, Notification of Proposed Production
Activity; Hitachi Vantara Manufacturing; (Enterprise Datacenter Disk
Storage System Hardware); Norman, Oklahoma
Hitachi Vantara Manufacturing submitted a notification of proposed
production activity to the FTZ Board (the Board) for its facility in
Norman, Oklahoma, within FTZ 106. The notification conforming to the
requirements of the Board's regulations (15 CFR 400.22) was received on
September 16, 2026.
Pursuant to 15 CFR 400.14(b), FTZ production activity would be
limited to the specific foreign-status material(s)/component(s) and
specific finished product(s) described in the submitted notification
(summarized below) and subsequently authorized by the Board. The
benefits that may stem from conducting production activity under FTZ
procedures are explained in the background section of the Board's
website--accessible via <a href="http://www.trade.gov/ftz">www.trade.gov/ftz</a>.
The proposed finished products include: various fans
(microprocessor cooling; accelerator); various bezels (flash model;
front cover); various drives (hard disk; flash module; solid state);
various boards (channel; front end communication controller; disk;
processor blade); various boxes (channel board; internal components
drive bay; flash drive); various chassis (controller; computer);
various adapters (host; back end communication disk); service
processors; cache memory chips; various kits (earthquake resistant rail
attachment; operation panel); brackets; computer chassis rack rails;
various modules (compression accelerator; optional encryption);
computer controllers; various panels (name plate d[eacute]cor; filler);
key kit brackets; computer chassis racks; controller slot safety
covers; storage bridge bays; RK42 rack side covers; maintenance PC
trays; power control units; nickel-metal hydride (NiMH) batteries;
fiber channel blades; network connection points; various cables (high
performance data; optical; peripheral component interconnect express;
copper; ethernet; local area network; quad small form factor
pluggable); various transceivers (quad small form factor pluggable;
small form factor pluggable); and, temporary data cache flash memory
chips (duty rate ranges from duty-free to 3.4%).
The proposed foreign-status materials/components include: various
ribbon (thermal transfer; label); various labels (blank polyester film;
self-adhesive polyester film; printed barcode); polyethylene bags;
various plastic components (connector covers; insulation sheets; name
plates; cable ties; tags; clamps); textile gaskets; longhead bolts of
iron or steel; various nickel components (bind screws; bolts; screws;
nuts); various steel components (not threaded ball studs; longhead
bolts; rail springs); stainless steel nuts; springs of iron or steel;
various fans (microprocessor cooling; axial); sheet metal boxes for
fans; various drives (hard magnetic disk; flash memory; solid state);
various units (adapter; computer controller; computer bezel faceplate;
central processing); mix adaptor instrument connectors; various modules
(dual in-line memory; optional encryption); accelerators with fans; air
guides; ball catches; various sheet metal components (base plates;
computer cage security enclosures; computer outer shell cannisters;
disc adaptor face plate covers; controller fan latch plates); brackets;
cable ducts; chamfer angle brackets; various boards (channel; light
emitting device; printed circuit); computer chassis; flexible
polyurethane foam cushions; drive boxes; dummy spacers; flanges;
gaskets; heat sinks; polyphenylene insulation; key plates; mylar
sheets; indicator panels; polycarbonate light pipes; printed circuit
board assemblies; rack rails; sheet metal fillers; shield fingers; wind
shields; AC/DC switching power supplies; chip inductors; chassis with
printed circuit board assemblies; various batteries (NiMH; lithium);
network connection points; various switches (ethernet; interconnect;
push; slide); optical transceivers; printed circuit board assemblies
with local area network controllers; various memory chips (temporary
data cache flash; dynamic read write random access; non-volatile flash
storage; electrically erasable programmable read only); chip
capacitors; chip resistors; computer connector ports; central
processing unit sockets; backplanes; various covers (quad small form
factor pluggable; front frame); socket carriers; power connector
housings; transistors; switch regulators; piezoelectric quartz
crystals; computer controllers; complex programmable logic devices;
field programmable gate arrays; system-on-chip processors; oscillators;
flash memory drive; power management integrated circuits; various
cables (copper telecommunication; flexible flat; optical fiber);
insulated wires; insulation sheets; and, polymer clad optical fiber
(duty rate ranges from duty-free to 7.9%).
The request indicates that certain materials/components are subject
to duties under section 232 of the Trade Expansion Act of 1962, or
section 301 of the Trade Act of 1974, depending on the country of
origin. The applicable section 232, and section 301 decisions require
subject merchandise to be admitted to FTZs in privileged foreign status
as described in 19 CFR 146.41.
Public comment is invited from interested parties. Submissions
shall be addressed to the Board's Executive Secretary and sent to:
<a href="/cdn-cgi/l/email-protection#3e584a447e4a4c5f5a5b10595148"><span class="__cf_email__" data-cfemail="a7c1d3dde7d3d5c6c3c289c0c8d1">[email protected]</span></a>. The closing period for their receipt is November 9,
2026.
A copy of the notification will be available for public inspection
in the ``Online FTZ Information System'' section of the Board's
website.
For further information, contact Juanita Chen at
<a href="/cdn-cgi/l/email-protection#771d0216191e031659141f121937030516131259101801"><span class="__cf_email__" data-cfemail="dcb6a9bdb2b5a8bdf2bfb4b9b29ca8aebdb8b9f2bbb3aa">[email protected]</span></a>.
Dated: September 23, 2026.
Colin Agostisi,
Executive Secretary.
[FR Doc. 2026-19777 Filed 9-25-26; 8:45 am]
BILLING CODE 3510-DS-P
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</html>Indexed from Federal Register on September 28, 2026.
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