Notice2026-02376
Foreign-Trade Zone (FTZ) 110, Notification of Proposed Production Activity; Intel Foundry Corporation; (Semiconductor Products); Rio Rancho and Albuquerque, New Mexico
Primary source
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Published
February 6, 2026
Issuing agencies
Commerce DepartmentForeign-Trade Zones Board
Full Text
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<title>Federal Register, Volume 91 Issue 25 (Friday, February 6, 2026)</title>
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[Federal Register Volume 91, Number 25 (Friday, February 6, 2026)]
[Notices]
[Pages 5426-5427]
From the Federal Register Online via the Government Publishing Office [<a href="http://www.gpo.gov">www.gpo.gov</a>]
[FR Doc No: 2026-02376]
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DEPARTMENT OF COMMERCE
Foreign-Trade Zones Board
[B-13-2026]
Foreign-Trade Zone (FTZ) 110, Notification of Proposed Production
Activity; Intel Foundry Corporation; (Semiconductor Products); Rio
Rancho and Albuquerque, New Mexico
Intel Foundry Corporation submitted a notification of proposed
production activity to the FTZ Board (the Board) for its facilities in
Rio Rancho and Albuquerque, New Mexico within Subzone 110E. The
notification conforming to the requirements of the Board's regulations
(15 CFR 400.22) was received on January 29, 2026.
Pursuant to 15 CFR 400.14(b), FTZ production activity would be
limited to the specific foreign-status material(s)/component(s) and
specific finished product(s) described in the submitted notification
(summarized below) and subsequently authorized by the Board. The
benefits that may stem from conducting production activity under FTZ
procedures are explained in the background section of the Board's
website--accessible via <a href="http://www.trade.gov/ftz">www.trade.gov/ftz</a>.
The proposed finished products include: photomasks; semiconductor
transducers; electronic integrated circuit processors; electronic
integrated optical circuits; electronic integrated circuit memories;
electronic integrated circuit amplifiers; electronic integrated
interposer circuits; electronic integrated circuits (not yet determined
to be processor or memory); printed circuits; and electronic integrated
circuits (duty-free).
The proposed foreign-status materials/components include: corundum;
methane (liquid and gas); chlorine; argon; oxygen; hydrogen; helium;
xenon; nitrogen; hydrochloric acid; hydrogen chloride; sulfuric acid;
nitric acid; phosphoric acid; hydrofluoric acid; silicate reagent;
hydrogen bromide; carbon dioxide; silica; carbon monoxide; nitrous
oxide; nitric oxide; sulfur dioxide; boron trichloride; dichlorosilane;
silane; silicon tetrachloride; chlorine trifluoride; diiodosilane;
nitrogen trifluoride; anhydrous ammonia; potassium hydroxide in solid
form; sulfur hexafluoride gas; tungsten hexafluoride; titanium
tetrachloride; carbonyl sulfide; copper sulphate solution; potassium
chloride electrode filling solution; cerium hydroxide; hydrogen
peroxide; disilane; phosphine of copper; octane; ethyne (acetylene);
trifluoromethane; halocarbon; difluoromethane; fluoromethane;
octafluorocyclobutane; isopropyl alcohol; tert-butyl alcohol;
hexachlorodisilane; 2-heptanone; cyclohexanone; cyclopentanone; sodium
acetate; butyl acetate; propylene glycol monomethyl ether acetate; 2-
methylamino)ethanol; tetramethylammonium hydroxide;
tetraethylsilanediamine; di-iso-propylaminosilane; tetramethylsilane;
trimethylaluminum; trimethylsilane; butyrolactone; potassium chloride;
butoxyethanol; ethanolamine; lubrication; ammonium; cerium dioxide;
tetraethylammonium
[[Page 5427]]
hydroxide; soldering, brazing or welding powder; triethanolamine based
solution; dimethyl sulfoxide; wafers polycrystalline silicon; cobalt
based solution; diborane gas; ethylene glycol based solution; xenon and
hydrogen mixture; melamine resin; ion exchanger resin; plastic case for
semiconductor wafers; ethylene bags for packing; ammonium fluoride;
plastic packing; plastic bottles; self-adhesive label; articles of
glass, quartz reactor tubes; filtering machine for water purification;
permanent metal magnets; central processing units (microprocessor);
memory; cobalt sputtering target; copper sputtering target; tantalum
sputtering target; titanium sputtering target; telecommunication
connectors; electrical conductors for telecommunication; electrical
conductors (low voltage cables); insulated electric conductors for
voltage not exceeding 1,000 volts; copper electrical conductors; fitted
electric conductors; electric conductors for voltage exceeding 1,000
volts; deuterium; hydrocarbon deposition solution; tantalum powder;
tetrakis (methylethylamino) zirconium; 2-propanol, 1-methoxy, 2-
aceetate based undercoat material; polyglycerol polymer based slurry;
surfactant solution; hydroxyethanediphsphonic acid based wafer cleaning
solution; acetic acid based slurry; amorphous silica based slurry;
silica and phosphoric acid based slurry; photoresist; 4-
morpholinecarbaldehyde based solution; nitrogen trifluoride;
benzotriazole based cleaning solution; helium and nitrogen mixture;
helium based compressed gas mixture; hydrogen and argon mixture;
isobutyl propionate-based developer solution; methane and argon
mixture; and, oxygen and helium mixture (duty rate ranges from duty-
free to 6.5%). The request indicates that certain materials/components
are subject to duties under section 1702(a)(1)(B) of the International
Emergency Economic Powers Act (section 1702), section 232 of the Trade
Expansion Act of 1962 (section 232), or section 301 of the Trade Act of
1974 (section 301), depending on the country of origin. The applicable
section 1702, section 232, and section 301 decisions require subject
merchandise to be admitted to FTZs in privileged foreign status (19 CFR
146.41).
Public comment is invited from interested parties. Submissions
shall be addressed to the Board's Executive Secretary and sent to:
<a href="/cdn-cgi/l/email-protection#5d3b29271d292f3c3938733a322b"><span class="__cf_email__" data-cfemail="294f5d53695d5b484d4c074e465f">[email protected]</span></a>. The closing period for their receipt is March 18, 2026.
A copy of the notification will be available for public inspection
in the ``Online FTZ Information System'' section of the Board's
website.
For further information, contact Christopher Wedderburn at
<a href="/cdn-cgi/l/email-protection#da99b2a8b3a9f48dbfbebebfa8b8afa8b49aaea8bbbebff4bdb5ac"><span class="__cf_email__" data-cfemail="e0a388928993ceb785848485928295928ea09492818485ce878f96">[email protected]</span></a>.
Dated: January 30, 2026.
Elizabeth Whiteman,
Executive Secretary.
[FR Doc. 2026-02376 Filed 2-5-26; 8:45 am]
BILLING CODE 3510-DS-P
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</html>Indexed from Federal Register on February 6, 2026.
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