Notice2026-01112
Foreign-Trade Zone (FTZ) 39, Notification of Proposed Production Activity; Qorvo US, Inc.; (Semiconductor Wafers, Modules, and Chips); Richardson, Texas
Primary source
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Published
January 22, 2026
Issuing agencies
Commerce DepartmentForeign-Trade Zones Board
Full Text
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<title>Federal Register, Volume 91 Issue 14 (Thursday, January 22, 2026)</title>
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[Federal Register Volume 91, Number 14 (Thursday, January 22, 2026)]
[Notices]
[Pages 2726-2727]
From the Federal Register Online via the Government Publishing Office [<a href="http://www.gpo.gov">www.gpo.gov</a>]
[FR Doc No: 2026-01112]
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DEPARTMENT OF COMMERCE
Foreign-Trade Zones Board
[B-6-2026]
Foreign-Trade Zone (FTZ) 39, Notification of Proposed Production
Activity; Qorvo US, Inc.; (Semiconductor Wafers, Modules, and Chips);
Richardson, Texas
Qorvo US, Inc. submitted a notification of proposed production
activity to the FTZ Board (the Board) for its facility in Richardson,
Texas, within FTZ 39. The notification conforming to the requirements
of the Board's regulations (15 CFR 400.22) was received on January 15,
2026.
Pursuant to 15 CFR 400.14(b), FTZ production activity would be
limited to the specific foreign-status material(s)/component(s) and
specific finished product(s) described in the submitted notification
(summarized below) and subsequently authorized by the Board. The
benefits that may stem from conducting production activity under FTZ
procedures are explained in the background section of the Board's
website--accessible via <a href="http://www.trade.gov/ftz">www.trade.gov/ftz</a>.
The proposed finished products include: wafers (gallium nitride;
gallium arsenide; unmounted transistor; gallium arsenide amplifier;
gallium nitride amplifier); telecommunications inductors; ferrite
beads; modules (integrated circuit switch; amplifier; microwave
amplifier); bias controllers; thermal spreaders; aluminum capacitors;
capacitor chips (ceramic single layer; ceramic multi-layer; ferrite);
resistors (two terminal fixed surface mounted; carbon film; fixed
surface mounted chip); printed circuit boards; printed circuit board
connectors; diodes; discrete transistors; integrated circuit-based
frequency and signal control units; and, integrated circuit lead frame
packages (duty rate ranges from duty-free to 3.7%).
The proposed foreign-status materials/components include: crystals
(iodine resublimed; quartz piezoelectric); solder (pure tin; lead-tin);
wafers (4 inch or 6 inch gallium nitride; 6 inch gallium arsenide; 6
inch doped gallium arsenide; 4 inch or 6 inch doped polycrystalline
silicon; 4 inch or 6 inch dope silicon carbide; 4 inch or 6 inch
unmounted transistor; 6 inch or 8 inch bulk acoustic wave filter; 6
inch surface acoustic wave filter; 6 inch pseudomorphic high electron
mobility transistor amplifier; 4 inch or 6 inch heterojunction bipolar
transistor amplifier; 6 inch high electron mobility transistor
amplifier; 6 inch bipolar high electron mobility transistor amplifier;
6 inch gallium arsenide amplifier; 4 inch or 6 inch gallium nitride
amplifier; 6 inch or 8 inch silicon carrier); 1-methyl-2-pyrrolidone-
99%; solutions (synthetic cleaning; dilute of acrylic copolymer/
ammonium hydroxide; copper sulfate); solder fluxes; compounds (epoxy
resin; epoxy resin molding for encapsulation of semiconductor devices);
thermosetting conductive die attach adhesives; tapes (low static;
ultraviolet; carrier; cover); plastic wafer trays; semiconductor tape
reels; pre-form pastes for gold-to-gold bonding; wires (gold; precut
copper; insulated); copper laminates; pellets (nickel; titanium);
aluminum scandium alloy ingots; aluminum heat sinks; wafer frames;
targets (aluminum silicon; tungsten physical vapor disposition;
aluminum scandium; germanium; tungsten; aluminum copper); solder
preforms; telecommunications inductors; ferrite beads; switches
(discrete; limit); circuits (antenna switch integrated; up/down
converter; upconverter); switch dies; amplifiers (power with duplexer
integrated circuits; spatium power; balanced X band gallium nitride low
noise; feedback; heterojunction bipolar transistor broadband feedback;
monolithic microwave integrated circuit; variable gain; driver); bias
controllers; thermal spreaders; aluminum capacitors; capacitor chips
(ceramic single layer; ceramic multi-layer; ferrite); resistors (two
terminal surface mounted fixed; carbon film; fixed surface mounted
chip; axial lead); lids (integrated circuit packaged; integrated
circuit); circuit boards (multi-layer printed; ceramic-based printed;
semiconductor testing device); connectors (coaxial; terminal; printed
circuit board); diodes (Zener; signal; rectifier; light-emitting);
transistors (packaged; discrete; power); filters (high pass; low pass);
complementary metal-oxide-semiconductor heterojunction bipolar
transistor amplifier dies; solid state power amplifier drivers; radio
frequency transceivers; attenuators; digital attenuators; doublers
(power; frequency); heat sinks; beamformers; phase shifters; microwave
amplifier modules; and, semiconductor device test boards (duty rate
ranges from duty-free to 6.1%).
The request indicates that certain materials/components are subject
to duties under section 1702(a)(1)(B) of the International Emergency
Economic Powers Act (section 1702), section 232 of the Trade Expansion
Act of 1962 (section 232), or section 301 of the Trade Act of 1974
(section 301), depending on the country of origin. The applicable
section 1702, section 232, and section 301 decisions require subject
merchandise to be admitted to FTZs in privileged foreign status (19 CFR
146.41).
Public comment is invited from interested parties. Submissions
shall be addressed to the Board's Executive Secretary and sent to:
<a href="/cdn-cgi/l/email-protection#4721333d07333526232269202831"><span class="__cf_email__" data-cfemail="e88e9c92a89c9a898c8dc68f879e">[email protected]</span></a>. The closing period for their receipt is March 3, 2026.
A copy of the notification will be available for public inspection
in the ``Online FTZ Information System'' section of the Board's
website.
[[Page 2727]]
For further information, contact Juanita Chen at
<a href="/cdn-cgi/l/email-protection#83e9f6e2edeaf7e2ade0ebe6edc3f7f1e2e7e6ade4ecf5"><span class="__cf_email__" data-cfemail="5d37283c3334293c733e3538331d292f3c3938733a322b">[email protected]</span></a>.
Dated: January 16, 2026.
Elizabeth Whiteman,
Executive Secretary.
[FR Doc. 2026-01112 Filed 1-21-26; 8:45 am]
BILLING CODE 3510-DS-P
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</html>Indexed from Federal Register on January 22, 2026.
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