Notice2026-01111
Foreign-Trade Zone (FTZ) 230, Notification of Proposed Production Activity; Qorvo US, Inc.; (Semiconductor Wafers, Modules, and Chips); Greensboro, North Carolina
Primary source
Metadata and text below are from the Federal Register, a public-domain U.S. government work. Always verify the official published version before relying on it for any legal matter.
Published
January 22, 2026
Issuing agencies
Commerce DepartmentForeign-Trade Zones Board
Full Text
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<title>Federal Register, Volume 91 Issue 14 (Thursday, January 22, 2026)</title>
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[Federal Register Volume 91, Number 14 (Thursday, January 22, 2026)]
[Notices]
[Pages 2725-2726]
From the Federal Register Online via the Government Publishing Office [<a href="http://www.gpo.gov">www.gpo.gov</a>]
[FR Doc No: 2026-01111]
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DEPARTMENT OF COMMERCE
Foreign-Trade Zones Board
[B-8-2026]
Foreign-Trade Zone (FTZ) 230, Notification of Proposed Production
Activity; Qorvo US, Inc.; (Semiconductor Wafers, Modules, and Chips);
Greensboro, North Carolina
Qorvo US, Inc. submitted a notification of proposed production
activity to the FTZ Board (the Board) for its facilities in Greensboro,
North Carolina, within Subzone 230K. The notification conforming to the
requirements of the Board's regulations (15 CFR 400.22) was received on
January 15, 2026.
Pursuant to 15 CFR 400.14(b), FTZ production activity would be
limited to the specific foreign-status material(s)/component(s) and
specific finished product(s) described in the submitted notification
(summarized below) and subsequently authorized by the Board. The
benefits that may stem from conducting production activity under FTZ
procedures are explained in the background section of the Board's
website--accessible via <a href="http://www.trade.gov/ftz">www.trade.gov/ftz</a>.
The proposed finished products include: telecommunications
inductors; modules (integrated circuit switch; amplifier); printed
circuit board antennas; low-temperature co-fired ceramic filters;
aluminum capacitors; capacitor chips (ceramic single layer; ceramic
multi-layer); resistors (two terminal fixed surface mounted; fixed
surface mounted chip); thermistors; printed circuit boards; circuit
board connectors; diodes; packaged transistors; transistors; light-
emitting diodes; integrated circuit-based frequency and signal control
units; dice controllers for background processing; amplifier wafers
(gallium arsenide; gallium nitride); and, radio frequency integrated
circuits (duty rates are duty-free).
The proposed foreign-status materials/components include: calcium
chlorides; clay desiccants; plastic wafer trays; wafer hoop rings;
semiconductor tape reels; polyethylene bags; tapes (carrier; cover);
cardboard boxes; polypropylene strapping; precut copper wires;
telecommunications inductors; ferrite beads; switches (discrete;
integrated circuit antenna; limit); switch dies; amplifiers (power with
duplexer integrated circuits; balanced X band gallium nitride low
noise; feedback; heterojunction bipolar transistor broadband feedback;
monolithic microwave integrated circuit; solid state power; variable
gain; driver); circuits (antenna tuner switch integrated; up/down
converter); electromagnetic shields; circuit boards (antenna printed;
multi-layer printed; semiconductor testing device); filters (low
temperature co-fired ceramic; thin-film; high pass; low pass);
capacitors (tantalum; aluminum); ceramic capacitor chips (single layer;
multi-layer); resistors (two terminal surface mounted fixed; carbon
film; fixed surface mounted chip); resistor networks; thermistors;
connectors (coaxial; terminal; printed circuit board); coin battery
cell surface mount device holders; diodes (Zener; signal; rectifier;
light-emitting); transistors (packaged; discrete; power); quartz
piezoelectric crystals; wafers (8 inch bulk acoustic wave filter; 6
inch surface acoustic wave filter; 6 inch or 8 inch background dice
controller; 6 inch heterojunction bipolar transistor amplifier; 6 inch
high-electron mobility transistor amplifier; 6 inch gallium arsenide
amplifier; 4 inch or 6 inch gallium nitride amplifier; 4 inch, 6 inch,
or 8 inch amplifier module); bias
[[Page 2726]]
controllers; radio frequency transceivers; attenuators; digital
attenuators; doublers (power; frequency); heat sinks; beamformers;
phase shifters; silicon wafer carriers (6 inch or 8 inch); integrated
circuit lids; semiconductor probe cards; and, semiconductor device test
boards (duty rate ranges from duty-free to 5.0%).
The request indicates that certain materials/components are subject
to duties under section 1702(a)(1)(B) of the International Emergency
Economic Powers Act (section 1702), section 232 of the Trade Expansion
Act of 1962 (section 232), or section 301 of the Trade Act of 1974
(section 301), depending on the country of origin. The applicable
section 1702, section 232, and section 301 decisions require subject
merchandise to be admitted to FTZs in privileged foreign (PF) status
(19 CFR 146.41). The request also indicates that polyethylene bags are
subject to an antidumping/countervailing duty (AD/CVD) order/
investigation if imported from certain countries. The Board's
regulations (15 CFR 400.13(c)(2)) require that merchandise subject to
AD/CVD orders, or items which would be otherwise subject to suspension
of liquidation under AD/CVD procedures if they entered U.S. customs
territory, be admitted to the zone in PF status.
Public comment is invited from interested parties. Submissions
shall be addressed to the Board's Executive Secretary and sent to:
<a href="/cdn-cgi/l/email-protection#7c1a08063c080e1d1819521b130a"><span class="__cf_email__" data-cfemail="0563717f4571776461602b626a73">[email protected]</span></a>. The closing period for their receipt is March 3, 2026.
A copy of the notification will be available for public inspection
in the ``Online FTZ Information System'' section of the Board's
website.
For further information, contact Juanita Chen at
<a href="/cdn-cgi/l/email-protection#167c6377787f627738757e737856626477727338717960"><span class="__cf_email__" data-cfemail="c9a3bca8a7a0bda8e7aaa1aca789bdbba8adace7aea6bf">[email protected]</span></a>.
Dated: January 16, 2026.
Elizabeth Whiteman,
Executive Secretary.
[FR Doc. 2026-01111 Filed 1-21-26; 8:45 am]
BILLING CODE 3510-DS-P
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</html>Indexed from Federal Register on January 22, 2026.
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