Notice2026-01110
Foreign-Trade Zone (FTZ) 45, Notification of Proposed Production Activity; Qorvo US, Inc.; (Semiconductor Wafers and Modules); Hillsboro, Oregon
Primary source
Metadata and text below are from the Federal Register, a public-domain U.S. government work. Always verify the official published version before relying on it for any legal matter.
Published
January 22, 2026
Issuing agencies
Commerce DepartmentForeign-Trade Zones Board
Full Text
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<title>Federal Register, Volume 91 Issue 14 (Thursday, January 22, 2026)</title>
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[Federal Register Volume 91, Number 14 (Thursday, January 22, 2026)]
[Notices]
[Pages 2724-2725]
From the Federal Register Online via the Government Publishing Office [<a href="http://www.gpo.gov">www.gpo.gov</a>]
[FR Doc No: 2026-01110]
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DEPARTMENT OF COMMERCE
Foreign-Trade Zones Board
[B-7-2026]
Foreign-Trade Zone (FTZ) 45, Notification of Proposed Production
Activity; Qorvo US, Inc.; (Semiconductor Wafers and Modules);
Hillsboro, Oregon
Qorvo US, Inc. submitted a notification of proposed production
activity to the FTZ Board (the Board) for its facility in Hillsboro,
Oregon, within Subzone 45K. The notification conforming to the
requirements of the Board's regulations (15 CFR 400.22) was received on
January 15, 2026.
Pursuant to 15 CFR 400.14(b), FTZ production activity would be
limited to
[[Page 2725]]
the specific foreign-status material(s)/component(s) and specific
finished product(s) described in the submitted notification (summarized
below) and subsequently authorized by the Board. The benefits that may
stem from conducting production activity under FTZ procedures are
explained in the background section of the Board's website--accessible
via <a href="http://www.trade.gov/ftz">www.trade.gov/ftz</a>.
The proposed finished products include: wafers (gallium arsenide;
doped gallium arsenide; gallium arsenide amplifier; gallium nitride
amplifier); modules (integrated circuit switch; amplifier); multi-layer
printed circuit boards; connectors (terminal; printed circuit board);
unmounted transistors; integrated circuit-based frequency and signal
control units; attenuators; radio frequency integrated circuits; and,
semiconductor testing devices (duty rate ranges from duty-free to
2.8%).
The proposed foreign-status materials/components include: wafers (4
inch or 6 inch gallium nitride; 6 inch gallium arsenide; 6 inch doped
gallium arsenide; 8 inch doped polycrystalline silicon; 8 inch bulk
acoustic wave filter; 6 inch surface acoustic wave filter finished; 6
inch pseudomorphic high electron mobility transistor amplifier; 6 inch
heterojunction bipolar transistor amplifier; 6 inch high electron
mobility transistor amplifier; 6 inch bipolar heterojunction electron
mobility transistor amplifier; 6 inch gallium arsenide amplifier; 4
inch or 6 inch gallium nitride amplifier; 6 inch amplifier module);
liquid precious metal replenishers; modified hydrocarbon resin liquid
adhesive mixtures; flux removers; pure tin solder cappings; tin
solders; corrosion inhibitors for closed cooling and heating systems;
tapes (ultraviolet; carrier); plastic wafer trays; semiconductor tape
reels; pre-form pastes for gold-to-gold bonding; pellets (gold;
platinum; non-alloy nickel; titanium; germanium); sputtering targets
(nickel; germanium; titanium; tungsten; nickel chromium silicon); wafer
frames; amplifiers (power with duplexer integrated circuits; balanced X
band gallium nitride low noise; feedback; heterojunction bipolar
transistor broadband feedback; monolithic microwave integrated circuit;
variable gain; driver); circuit boards (multi-layer printed;
semiconductor testing device); connectors (terminal; printed circuit
board); unmounted transistor modules; filters (high pass; low pass);
circuits (silicon-on-insulator switch; up/down converter);
complementary metal-oxide semiconductors; bias controllers; solid state
power amplifier drivers; attenuators; digital attenuators; transistors
(discrete; power); doublers (power; frequency); limit switches; heat
sinks; beamformers; phase shifters; and, semiconductor testing devices
(duty rate ranges from duty-free to 6.0%).
The request indicates that certain materials/components are subject
to duties under section 1702(a)(1)(B) of the International Emergency
Economic Powers Act (section 1702), section 232 of the Trade Expansion
Act of 1962 (section 232), or section 301 of the Trade Act of 1974
(section 301), depending on the country of origin. The applicable
section 1702, section 232, and section 301 decisions require subject
merchandise to be admitted to FTZs in privileged foreign status (19 CFR
146.41).
Public comment is invited from interested parties. Submissions
shall be addressed to the Board's Executive Secretary and sent to:
<a href="/cdn-cgi/l/email-protection#4c2a38360c383e2d2829622b233a"><span class="__cf_email__" data-cfemail="4d2b39370d393f2c2928632a223b">[email protected]</span></a>. The closing period for their receipt is March 3, 2026.
A copy of the notification will be available for public inspection
in the ``Online FTZ Information System'' section of the Board's
website.
For further information, contact Juanita Chen at
<a href="/cdn-cgi/l/email-protection#e08a95818e899481ce8388858ea09492818485ce878f96"><span class="__cf_email__" data-cfemail="48223d2926213c29662b202d26083c3a292c2d662f273e">[email protected]</span></a>.
Dated: January 16, 2026.
Elizabeth Whiteman,
Executive Secretary.
[FR Doc. 2026-01110 Filed 1-21-26; 8:45 am]
BILLING CODE 3510-DS-P
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</html>Indexed from Federal Register on January 22, 2026.
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