Notice2024-14844
Notice of Availability of Final Programmatic Environmental Assessment for Modernization and Expansion of Existing Semiconductor Fabrication Facilities Under the CHIPS Incentives Program
Primary source
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Published
July 8, 2024
Issuing agencies
Commerce Department
Abstract
The National Institute of Standards and Technology (NIST) announces the availability of the Final Programmatic Environmental Assessment (PEA) and finding of no significant impact (FONSI) for the modernization and expansion of existing semiconductor fabrication facilities under the CHIPS Incentives Program. The Final PEA addresses Federal financial assistance under the CHIPS Incentives Program for the proposed modernization or expansion of existing current-generation, mature-node, or leading-edge front- or back-end commercial semiconductor fabrication facilities within existing facility footprints.
Full Text
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<title>Federal Register, Volume 89 Issue 130 (Monday, July 8, 2024)</title>
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[Federal Register Volume 89, Number 130 (Monday, July 8, 2024)]
[Notices]
[Pages 55920-55921]
From the Federal Register Online via the Government Publishing Office [<a href="http://www.gpo.gov">www.gpo.gov</a>]
[FR Doc No: 2024-14844]
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DEPARTMENT OF COMMERCE
Notice of Availability of Final Programmatic Environmental
Assessment for Modernization and Expansion of Existing Semiconductor
Fabrication Facilities Under the CHIPS Incentives Program
AGENCY: National Institute of Standards and Technology, Department of
Commerce.
ACTION: Notice; availability of a Final Programmatic Environmental
Assessment and finding of no significant impact.
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SUMMARY: The National Institute of Standards and Technology (NIST)
announces the availability of the Final Programmatic Environmental
Assessment (PEA) and finding of no significant impact (FONSI) for the
modernization and expansion of existing semiconductor fabrication
facilities under the CHIPS Incentives Program. The Final PEA addresses
Federal financial assistance under the CHIPS Incentives Program for the
proposed modernization or expansion of existing current-generation,
mature-node, or leading-edge front- or back-end commercial
semiconductor fabrication facilities within existing facility
footprints.
ADDRESSES: The Final PEA and FONSI are available for review and
download at <a href="https://www.nist.gov/chips/national-environmental-policy-act-nepa">https://www.nist.gov/chips/national-environmental-policy-act-nepa</a>.
FOR FURTHER INFORMATION CONTACT: David Frenkel, NIST, telephone number
240-204-1960, email <a href="/cdn-cgi/l/email-protection#531732253a377d1521363d38363f13303b3a23207d343c25"><span class="__cf_email__" data-cfemail="044065726d602a4276616a6f616844676c6d74772a636b72">[email protected]</span></a>.
SUPPLEMENTARY INFORMATION: NIST prepared the Final PEA in accordance
with the National Environmental Policy Act (NEPA), 42 U.S.C. 4321 et
seq., and the Council on Environmental Quality (CEQ) NEPA implementing
regulations, 40 CFR parts 1500-1508. The Final PEA addresses Federal
financial assistance for the proposed modernization or expansion of
existing current-generation, mature-node, or leading-edge front- or
back-end commercial semiconductor fabrication facilities within
existing facility footprints (the Proposed Action).
Background
The Creating Helpful Incentives to Produce Semiconductors (CHIPS)
for America Act in title XCIX of the William M. (Mac) Thornberry
National Defense Authorization Act for Fiscal Year 2021 (Pub. L. 116-
283), as amended by the CHIPS and Science Act of 2022 (Division A of
Pub. L. 117-167) (together, the CHIPS Act or Act) authorized the CHIPS
Incentives Program within the U.S. Department of Commerce. The Program,
which is administered by the CHIPS Program Office (CPO) within NIST, an
agency of the Department, aims to boost American semiconductor
research, development, and production.
The CHIPS Incentives Program Commercial Fabrication Facilities
Notice of Funding Opportunity (NOFO) was originally published in
February 2023 and amended in June 2023. The NOFO solicits applications
for the construction, expansion, or modernization of commercial
facilities for the front- or back-end fabrication of leading-edge,
current-generation, and mature-node semiconductors; commercial
facilities for wafer manufacturing; and commercial facilities for
materials used to manufacture semiconductors and semiconductor
manufacturing equipment, provided that the capital investment equals or
exceeds $300 million. The potential amount available under the NOFO is
up to $38.22 billion for direct funding and up to $75 billion in direct
loan or guaranteed principals. CPO is responsible for completion of the
NEPA process before Federal financial assistance can be disbursed.
Final PEA
The purpose of the CHIPS Incentives Program in this area is to
invest in U.S. production of strategically important semiconductors
(``chips'') and ensure a sufficient, sustainable, and secure supply of
older and current generation chips for national security purposes and
critical manufacturing industries. As part of this effort, CPO aims to
increase semiconductor manufacturing capacity and strengthen the
security of the U.S. supply chain via the modernization of
semiconductor production. The need for CPO's action in this area is to
fulfill the agency's statutory responsibilities under the CHIPS Act,
including the requirements of 15 U.S.C. 4652 to incentivize investment
in facilities and equipment in the United States for the fabrication,
assembly, testing, advanced packaging, production, or research and
development of semiconductors, materials used to manufacture
semiconductors, or semiconductor manufacturing equipment.
Under the Proposed Action, CPO would provide Federal financial
assistance for the proposed modernization or expansion of existing
current-generation, mature-node, or leading-edge front- or back-end
commercial semiconductor fabrication facilities within existing
facility footprints. Eligible projects would include the replacement or
upgrade of existing fab equipment, the addition of new semiconductor
manufacturing equipment, and the expansion of cleanroom space.
CPO published the Notice of Availability of the Draft PEA for
public comment in the Federal Register on December 27, 2023.\1\ CPO
extended the 30-day public comment period by two weeks from January 25,
2024, to February 9, 2024.\2\ CPO considered the public comments
received on the Draft PEA and has responded to comments in Appendix E
of the Final PEA. CPO has made revisions to the PEA in response to
comments where appropriate.
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\1\ 88 FR 89372 (Dec. 27, 2023).
\2\ 89 FR 6506 (Feb. 1, 2024).
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Based on its analysis, CPO has determined that the Proposed Action
to provide Federal financial assistance for the proposed modernization
or expansion of existing current-generation, mature-node, or leading-
edge front- or back-end commercial semiconductor fabrication facilities
(or ``fabs'') within existing fab facility footprints normally would
not result in significant adverse environmental effects. Thus,
preparation of a programmatic environmental impact
[[Page 55921]]
statement (EIS) is not required, and CPO is issuing a FONSI for the
Proposed Action.
Authority: This notice is provided pursuant to NEPA, 42 U.S.C.
4336(b)(2), and the NEPA implementing regulations, 40 CFR 1506.6.
Alicia Chambers,
NIST Executive Secretariat.
[FR Doc. 2024-14844 Filed 7-5-24; 8:45 am]
BILLING CODE 3510-13-P
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