Notice2023-04964
Foreign-Trade Zone (FTZ) 138, Notification of Proposed Production Activity; Intel Corporation; (Semiconductor Products); New Albany, Ohio
Primary source
Metadata and text below are from the Federal Register, a public-domain U.S. government work. Always verify the official published version before relying on it for any legal matter.
Published
March 10, 2023
Issuing agencies
Commerce DepartmentForeign-Trade Zones Board
Full Text
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<title>Federal Register, Volume 88 Issue 47 (Friday, March 10, 2023)</title>
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[Federal Register Volume 88, Number 47 (Friday, March 10, 2023)]
[Notices]
[Pages 14978-14979]
From the Federal Register Online via the Government Publishing Office [<a href="http://www.gpo.gov">www.gpo.gov</a>]
[FR Doc No: 2023-04964]
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DEPARTMENT OF COMMERCE
Foreign-Trade Zones Board
[B-19-2023]
Foreign-Trade Zone (FTZ) 138, Notification of Proposed Production
Activity; Intel Corporation; (Semiconductor Products); New Albany, Ohio
Intel Corporation submitted a notification of proposed production
activity to the FTZ Board (the Board) for its facility in New Albany,
Ohio, within Subzone 138I. The notification conforming to the
requirements of the Board's regulations (15 CFR 400.22) was received on
March 2, 2023.
Pursuant to 15 CFR 400.14(b), FTZ production activity would be
limited to the specific foreign-status material(s)/component(s) and
specific finished product(s) described in the submitted notification
(summarized below) and subsequently authorized by the Board. The
benefits that may stem from conducting production activity under FTZ
procedures are explained in the background section of the Board's
website--accessible via <a href="http://www.trade.gov/ftz">www.trade.gov/ftz</a>.
The proposed finished products include semiconductor transducers,
electronic integrated circuit processors and amplifiers, electronic
memory circuits, and electronic integrated circuits (duty rates are
duty-free).
The proposed foreign-status materials and components include:
methane (liquid; gas); chlorine; oxygen; hydrogen; helium; xenon;
nitrogen; hydrochloric acid; hydrogen chloride; nitric acid; phosphoric
acid; phosphoric acid based solution; hydrofluoric acid (also known as
hydrogen fluoride); silicate reagent; hydrogen bromide; carbon dioxide;
silica; carbon monoxide; dinitrogen monoxide (also known as nitrous
oxide); nitric oxide; sulfur dioxide; boron trichloride;
dichlorosilane; silane; silicon tetrachloride; chlorine trifluoride;
diiodosilane; nitrogen trifluoride; anhydrous ammonia; ammonia;
potassium hydroxide; potassium hydroxide based slurry; sulfur
hexafluoride gas; tungsten hexafluoride; potassium hydroxide based
slurry; sulfur hexafluoride gas; tungsten hexafluoride; titanium
tetrachloride; carbonyl sulfide; copper sulphate solution; potassium
chloride electrode filling solution; cerium hydroxide based slurry;
hydrogen peroxide; disilane; n-octane; ethyne (also known as
acetylene); hydrocarbon solution; trifluoromethane; tetrafluoromethane
(also known as perfluoromethane); hexafluoro-1,3-butadiene;
octafluorocyclobutane; isopropyl alcohol; tert-butyl alcohol;
hexachlorodisilane; 2-heptanone; cyclohexanone; cyclopentanone; butyl
acetate; propylene glycol monomethyl ether acetate (PGMEA);
pentakis(dimethylamido)tantalum powder;
tetrakis(methylethylamino)zirconium; N-methylethanolamine solution;
tetramethylammonium hydroxide developer solution;
bis(diethylamino)silane; hexamethyldisilazane photoresist; N,N-bis(1-
methylethyl)silanamine; tetramethylsilane; trimethylaluminum;
trimethylsilane; butyrolactone; potassium chloride based solution;
methyl 2-hydroxyisobutyrate based photoresist solution; PGMEA based
photoresist solution; PGMEA based undercoat material; polyglycerol
polymer based slurry; surfactant solution; butoxyethanol based wafer
cleaning solution; ethanolamine based wafer cleaning solution; 1-
hydroxyethane-1,1-diphosphonic acid based wafer cleaning solution; bolt
release lubrication; acetic acid based slurry; ammonium hydroxide based
slurry; amorphous silica based slurry; cerium dioxide based slurry;
potassium hydroxide based slurry; silica based slurry;
tetraethylammonium hydroxide based slurry; silica and phosphoric acid
based slurry; various mixtures (photoresist chemicals; diborane and
argon; diborane and hydrogen; fluorine
[[Page 14979]]
and nitrogen; helium and nitrogen; helium based compressed gas;
hydrogen and argon; hydrogen and helium; hydrogen and nitrogen; methane
and argon; oxygen and helium; xenon and hydrogen); soldering, brazing,
or welding powder; triethanolamine based solution; dimethyl sulfoxide
based cleaning solvent; propylene glycol monomethyl ether based
solvent; tetramethylammonium hydroxide based cleaning solvent; semi-
processed semiconductor wafers; 4-morpholinecarbaldehyde based
solution; acetic acid based solution; ammonium fluoride based solution;
benzotriazole based cleaning solution; cobalt based solution; ethylene
glycol based solution; isobutyl propionate based developer solution;
nitric acid based solution; phosphoric acid based solution;
tetrahydrothiophene-1,1-dioxide based solution; anti-reflective
photoresist chemical coating; melamine resin; ion exchangers; plastic
components (cases; packing; bottles); ethylene bags; self-adhesive
labels; quartz reactor tubes; copper anode discs; filtering machinery
for liquids; permanent metal magnets; central processing units;
microprocessors; electronic memory circuits; sputtering targets
(cobalt; copper; tantalum; titanium); electrical conductors for a
voltage not exceeding 1,000 V (fitted with connectors and used in
telecommunication; not used in telecommunication); electrical
conductors for a voltage not exceeding 80 V; insulated electrical
conductors for a voltage not exceeding 1,000 V; copper electrical
conductors for a voltage not exceeding 80 V; fitted electrical
conductors for a voltage exceeding 1,000 V; and, electrical conductors
for a voltage exceeding 1,000 V (duty rate ranges from duty-free to
6.5%). The request indicates that certain materials/components are
subject to duties under section 232 of the Trade Expansion Act of 1962
(section 232) or section 301 of the Trade Act of 1974 (section 301),
depending on the country of origin. The applicable section 232 and
section 301 decisions require subject merchandise to be admitted to
FTZs in privileged foreign status (19 CFR 146.41).
Public comment is invited from interested parties. Submissions
shall be addressed to the Board's Executive Secretary and sent to:
<a href="/cdn-cgi/l/email-protection#e086949aa09492818485ce878f96"><span class="__cf_email__" data-cfemail="b4d2c0cef4c0c6d5d0d19ad3dbc2">[email protected]</span></a>. The closing period for their receipt is April 19, 2023.
A copy of the notification will be available for public inspection
in the ``Online FTZ Information System'' section of the Board's
website.
For further information, contact Juanita Chen at
<a href="/cdn-cgi/l/email-protection#ed87988c8384998cc38e858883ad999f8c8988c38a829b"><span class="__cf_email__" data-cfemail="aec4dbcfc0c7dacf80cdc6cbc0eedadccfcacb80c9c1d8">[email protected]</span></a>.
Dated: March 7, 2023.
Elizabeth Whiteman,
Acting Executive Secretary.
[FR Doc. 2023-04964 Filed 3-9-23; 8:45 am]
BILLING CODE 3510-DS-P
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